CLP Engineering Studies Award 2027 (HK Programme)
- LocationHong Kong
- Work typeOn-site
- Posted9 November 2026
- SourceCLP Holdings's careers page (Oracle Recruiting)
Live checkFirst seen 2 h ago; still listed on CLP Holdings's careers page 2 h ago.
At a glance
- VisaRight to work required
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Passionate about engineering and ready to power the future? The CLP Engineering Studies Award (ESA) is designed for outstanding university students majoring in Electrical or Mechanical Engineering . More than a scholarship, ESA offers a unique opportunity to gain real-world experience, learn from industry experts, and kick-start an engineering career with CLP.
As an ESA awardee, you will:
- Receive a HK$50,000 Cash Award to support your final-year studies
- Join the CLP Internship Programme and gain hands-on experience in Hong Kong's leading energy business
- Be paired with experienced engineering professionals through a dedicated Mentorship Programme
- Receive an Engineering Graduate Trainee offer upon successful completion of the internship, graduation, and programme requirements, providing a seamless transition from university to a professional engineering career
Who should apply
To apply for this award, you must:
- Be a full-time undergraduate student
- Be entering your final year of study in Academic Year 2027/28 (expected graduation by July 2028)
- Major in Electrical Engineering or Mechanical Engineering
- Demonstrate strong academic performance and a genuine passion for engineering
- Have the right to live and work in Hong Kong
Application deadline: 27 December 2026 (Sunday)
Take the first step towards an exciting engineering career with CLP.
Learn more and apply: https://clp.to/esa
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