<New Graduate Hiring> Wire Bond Process Engineer

- Monitor and optimize Wire Bond manufacturing processes to achieve targets in Quality, Yield, Productivity, and Cost.

- Investigate manufacturing issues, customer complaints, and quality excursions by performing root cause analysis and implementing corrective/preventive actions.

- Drive continuous improvement projects to enhance process robustness, equipment utilization, OEE, yield performance, and operational efficiency.

- Establish and maintain process control systems, including SPC, OCAP, FMEA, control plans, and engineering specifications.

- Collaborate with cross-functional teams including Production, Equipment Engineering, Quality, Industrial Engineering, Planning, and R&D to resolve manufacturing challenges and improve factory performance.

- Analyze manufacturing data and develop data-driven solutions for process optimization and defect reduction.

- Conduct regular Gemba activities, risk assessments, and process audits to ensure manufacturing compliance and operational excellence.

- Support customer audits, internal audits, and quality management system requirements.

- Drive factory KPIs improvement, including Yield, Quality, Capacity, OEE, Cycle Time, and Cost Reduction targets.

Requirements:

- Bachelor’s degree or above in Engineering or a related field.

- TOEIC 600+ or equivalent English proficiency.

- Within 2 years of working experience. Semiconductor industry experience is preferred.

- Good communication and teamwork skills.

- Leadership experience or potential is a plus.

- Proactive, responsible, and willing to learn in a dynamic environment.

More information about NXP in Greater China...

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