Principal Engineer Package Concept Engineering (f/m/div)
- LocationMch CAMP; Regensburg
- Work typeHybrid
- Posted6 November 2026
- SourceInfineon Technologies's careers page (Eightfold)
Live checkFirst seen 29 min ago; still listed on Infineon Technologies's careers page 29 min ago.
Moves fastWhen Infineon Technologies takes a role down early, it is usually about 6 days after posting. Apply soon.
At a glance
- Experience6+ years
- Skills and toolsAutoCAD
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Check my fitAbout the role
#WeAreIn for jobs that impact everyone's life.
What if your ideas could change the way the world connects, powers up,
or thinks?
As a Principal Engineer Package Concept Engineering in our Research
& Development team, you will have the opportunity to merge creativity with
your technical expertise by shaping the future of technology, driving
groundbreaking projects, and bringing new ideas to life. Are you in?
Your role Key responsibilities in your new role
- Developing and refining innovative
package concepts for powering AI computing , with a focus on modules
- Validating the concepts using simulations and hardware demonstrators in collaboration with backend and product development teams and system architects
- Developing new ideas and assembly concepts in collaboration with backend development (in-house + OSAT) and initiating early-stage development projects to advance our packaging development
- Supporting development
projects through to market launch
Identifying and integrating technological trends into the overarching packaging
roadmap
- Advising customers on packaging-specific issues and continuously monitoring the market to develop innovative
business strategies
Your profile Qualifications and skills to help you succeed
- A degree in electrical engineering , physics , materials science ,
or an equivalent field
- At least 6 years of professional experience in package technology and several years of hands-on experience in assembly technologies , as well as in-depth knowledge of backend processes , materials , and their
interrelationships —ideally with knowledge of SMT-related technologies
- Experience working with design tools such as AutoCAD or Cadence
- Ability to solve complex problems by proactively engaging a network
of experts
- Willingness
to travel occasionally to visit customers and suppliers
- Ability to communicate and present fluently in German and English
#WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone.
We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.
Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.
Please let your recruiter know if you need any accommodations during the interview process.
Learn more about our various contact channels and about Diversity & Inclusion at Infineon.
Dagny Alexa Romeike
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